The latest trend in electronic device manufacturing points towards the compact and fast devices and to attain the same requirement, scientist from US are functioning on a novel technology-Nano technology.
The future processors are reason to be more powerful and use less energy and a team at California University is working on a silicon wafers between five and 20 nanometres thick, which may be used in the design of IC(Integrated Circuit) chips. The novel technology is based leading BCP(block co-polymer lithography).
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